Plasma Etching & Deposition in Bangladesh

Oxford Instruments plasma process systems for reactive ion etching, ICP etching, PECVD, ICPCVD and atomic layer deposition.

23 products from 5 manufacturers: Denton Vacuum, ParteQ, FCT Systeme, Moorfield Nanotechnology, Oxford Instruments.

Products

• Infinity Ion Beam Etch — Denton Vacuum: A production wafer etch system for ion beam etching, thin film profile milling and glancing angle milling. A built-in tilting chuck allows etching at an angle, and an optional SIMS endpoint detector terminates the etch on the chosen layer.
• Phoenix PIB-CVD — Denton Vacuum: An in-line large area coating system built around Denton's patented linear ion source, running the tunable Plasma Ion Beam CVD process. Ion energy and gas ratio can be adjusted to give anything from a soft flowable encapsulation layer to a hard, hydrophobic and optically clear coating.
• Voyager PE-CVD — Denton Vacuum: A plasma enhanced chemical vapour deposition system focused on diamond-like carbon, able to coat flat wafers and three dimensional parts such as optical lenses. An optional chamber configuration allows metals to be co-sputtered during deposition to give metal doped DLC films.
• Voyager PIB-CVD — Denton Vacuum: A plasma ion beam chemical vapour deposition system built around the filament-free Endeavor RF ion source, aimed at diamond-like nanocomposite films. Deposition runs below 100 degrees C, so polycarbonate and PMMA substrates can be coated directly.
• Plasma Emission Monitoring (PEM) — Denton Vacuum: A closed loop control system for transition mode, high rate reactive sputtering of metal oxides and nitrides. It reads a plasma emission line in real time and adjusts the reactive gas setpoint to hold intensity constant, which avoids target poisoning and keeps deposition rates near metal mode.
• WSR50 and WSR160 Fluidized Bed CVD Reactors — ParteQ: Fluidised bed reactors that coat powders by chemical vapour deposition, building mixed oxides, supported metal islands, core-shell structures and Janus particles. WSR50 covers laboratory work and WSR160 covers pilot scale production.
• Spark Plasma Sintering Furnace Type HP D — FCT Systeme: A directly heated spark plasma sintering system for the field assisted sintering technique. Pulsed direct current passes through the tool and the component, so cycle times fall to a few minutes and nanomaterials, graded materials and hardmetals can be densified at lower temperatures.
• Spark Plasma Sintering Furnace Type HHP D hybrid — FCT Systeme: A hybrid heated FAST/SPS system that combines direct pulsed current heating with one or more external heating systems acting on the press tool. The added external heat balances thermal gradients in large parts and in materials with poor thermal conductivity.
• nanoCVD-8G — Moorfield Nanotechnology: A benchtop chemical vapour deposition system for graphene, carbon nanomaterials and advanced materials growth. It gives research groups local CVD process development without the footprint of a production derived CVD tool.
• nanoETCH — Moorfield Nanotechnology: A compact plasma etching and surface modification system for low damage process development. It is used on 2D materials, graphene, silicon and oxide layers, and for substrate cleaning and surface activation before deposition.
• nanoANNEAL — Moorfield Nanotechnology: A benchtop thermal processing and annealing system for post deposition treatment. It is used for contact formation, crystallisation and interface work in photovoltaic, semiconductor and coatings research.
• Atomfab — Oxford Instruments: Atomfab is a plasma enhanced atomic layer deposition system built for volume production of GaN power and RF devices. A remote plasma source designed for atomic scale processing gives low damage passivation and gate dielectric films, with clusterable automated wafer handling.
• PlasmaPro ASP — Oxford Instruments: PlasmaPro ASP is a remote plasma enhanced ALD system sharing the Atomfab platform. It deposits conformal oxides and nitrides across 200 mm wafers at high rate, using a low volume chamber for rapid gas exchange and a biased electrode for tuning film properties.
• PlasmaPro 100 ALE — Oxford Instruments: The PlasmaPro 100 ALE applies a cyclical, digital etch process for precise depth control on nanoscale layers. Built on the Cobra ICP platform, it removes material with low damage and smooth surfaces for GaN HEMT recess etching and 2D material patterning.
• PlasmaPro 100 ALE with Etchpoint — Oxford Instruments: This configuration pairs the PlasmaPro 100 ALE with the Etchpoint UV reflectance etch depth monitor developed with LayTec. It measures remaining AlGaN thickness during processing, so p-GaN HEMT and recessed gate MISHEMT structures can be etched to a set depth.
• PlasmaPro 100 Cobra ICP RIE — Oxford Instruments: The PlasmaPro 100 Cobra ICP RIE uses a high density inductively coupled plasma for fast etch rates with independent control of substrate bias. It handles wafers up to 200 mm and serves GaAs and InP optoelectronics, microLEDs, SiC and GaN power devices and MEMS.
• PlasmaPro 100 Cobra GaAs VCSEL — Oxford Instruments: A PlasmaPro 100 Cobra configuration set up for volume VCSEL manufacture. The process gives a clean mesa sidewall finish, controlled profile angle for critical dimension control and very low footing, working with either photoresist or a hard mask.
• PlasmaPro 100 RIE — Oxford Instruments: The PlasmaPro 100 RIE delivers isotropic and anisotropic dry etching across a wide process range. A single RF plasma source sets both ion density and energy, with load lock and cassette to cassette options for repeatable research and production work up to 200 mm.
• PlasmaPro 100 Estrelas DRIE — Oxford Instruments: The PlasmaPro 100 Estrelas creates deep, steep sided trenches and vias in silicon. It runs both Bosch and cryogenic processes in the same chamber, covering high rate cavity etches, high aspect ratio features and tapered vias for MEMS and advanced packaging.
• PlasmaPro 100 PECVD — Oxford Instruments: The PlasmaPro 100 PECVD deposits dielectric and silicon based films with control of refractive index, stress, electrical properties and wet chemical etch rate. Dual frequency power applied to the showerhead electrode allows stress control and film densification.
• PlasmaPro 100 ICPCVD — Oxford Instruments: The PlasmaPro 100 ICPCVD uses a high density remote plasma to grow dielectric films at low temperature with little substrate damage. Typical materials include silicon dioxide, silicon nitride, silicon oxynitride, silicon and silicon carbide on wafers up to 200 mm.
• PlasmaPro 100 Nano CVD — Oxford Instruments: The PlasmaPro 100 Nano, formerly Nanofab, is a high temperature CVD and PECVD system for growing 1D and 2D nanomaterials and heterostructures. A cold wall chamber with showerhead delivery supports graphene, hBN, transition metal dichalcogenide and nanotube growth.
• Ionfab — Oxford Instruments: Ionfab systems perform ion beam etching, milling and ion beam deposition in a single chamber, with beam energy and ion flux controlled independently. Platen tilt sets the sidewall profile, and handling options run from open load to cassette to cassette.

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