Brand: Oxford Instruments | Category: Nanotechnology
Ionfab systems perform ion beam etching, milling and ion beam deposition in a single chamber, with beam energy and ion flux controlled independently. Platen tilt sets the sidewall profile, and handling options run from open load to cassette to cassette.
| Parameter | Value |
|---|---|
| Wafer size | 100 mm or 200 mm |
| Etch RF ion source | 15 cm or 30 cm |
| Substrate rotation speed | up to 20 RPM standard, 500 RPM optional |
| Substrate tilt angle | -90° horizontal to +65° facing down |
| Platen temperature | 10 °C to 300 °C, chiller or heater configuration |
| Deposition ion source | 15 cm, 13.56 MHz driven, up to four targets with shutter |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for Oxford Instruments.
Phone: +880 1711-738207 | Email: info@vvon.com.bd