Brand: Denton Vacuum | Category: Nanotechnology
A production wafer etch system for ion beam etching, thin film profile milling and glancing angle milling. A built-in tilting chuck allows etching at an angle, and an optional SIMS endpoint detector terminates the etch on the chosen layer.
| Parameter | Value |
|---|---|
| Wafer size | up to 200 mm |
| Specification | Built-in tilting chuck for etching at an angle |
| Options | integrated SIMS endpoint detection with Semiconductor Layer Stop Technology |
| Options | optical emissions sensor endpoint, automatic sample transfer with load lock, chemical assist |
| Specification | Class 1000 cleanroom compatible, ballroom style, and ESD compliant |
| Specification | Compatible with all Denton front end options including the Versa cluster platform |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for Denton Vacuum.
Phone: +880 1711-738207 | Email: info@vvon.com.bd