Electron Microscopy & Microanalysis in Bangladesh

Electron Microscopy & Microanalysis from Denton Vacuum, Jandel Engineering, SUSS MicroTec, ParteQ, Lake Shore, Moorfield Nanotechnology, FCT Systeme, WissEl, Carbolite Gero, Hitachi High-Tech, Oxford Instruments, Renishaw, Coherent, Semian and Honeywell, supplied, installed and supported in Bangladesh by Vvon Technologies.

139 products from 15 manufacturers: Denton Vacuum, Jandel Engineering, SUSS MicroTec, ParteQ, Lake Shore, Moorfield Nanotechnology, FCT Systeme, WissEl, Carbolite Gero, Hitachi High-Tech, Oxford Instruments, Renishaw, Coherent, Semian, Honeywell.

Products

• Infinity FA System — Denton Vacuum: An etching tool for semiconductor failure analysis, thin film profiling and delayering. It combines ion beam etch, reactive ion beam etch and chemically assisted ion beam etch so that layers of mixed composition can be removed at matched rates.
• BenchTop Turbo — Denton Vacuum: A compact high vacuum system for low voltage resistive thermal evaporation and sputtering, sized to fit within 32 inches of bench width. It is used for high vacuum carbon coating, high resolution microscopy coatings and rotary shadowing, and is run from a touch screen interface.
• Desk V — Denton Vacuum: A bench top sample preparation system that combines magnetron sputtering with thermal carbon evaporation for electron microscopy. An adjustable rotating and tilting stage gives even coverage on samples with irregular surfaces, and a broad range of coating materials including iridium can be deposited.
• Jandel General Purpose System — Jandel Engineering: The General Purpose System pairs the RM3000+ Test Unit with the Multiheight Probe Stand and is the combination Jandel sells most. The adjustable probe height takes samples from thin layers and wafers up to ingots 250 mm high, with thicker samples accommodated on request.
• Jandel Multipurpose Four Point Probe System — Jandel Engineering: The Multipurpose System combines the Multiheight Probe Stand and RM3000+ Test Unit with a removable micrometer controlled X-Y table. Small samples such as coated glass slides can be positioned precisely, and with the table removed the stand takes wafers and ingots.
• Jandel Wafer Probing System — Jandel Engineering: The Wafer Probing System pairs the RM3000+ Test Unit with the Multiposition Probe Stand for repeatable measurement across wafers. Indexed theta and linear movements return the probe to set points, which suits five point and nine point wafer uniformity routines.
• Jandel Portable Probing System — Jandel Engineering: The Portable Probing System pairs the HM21 Test Unit with the Hand Applied Probe for measurements made away from a fixed stand. It handles thin layers, wafers and large ingots, but the high downward force means it is not suitable for fragile unsupported samples.
• MA12 Gen3 Semi-Automated Mask Aligner and Imprint System — SUSS MicroTec: A semi-automated mask aligner and imprint tool for wafers up to 300 mm. It combines full field UV exposure with SMILE imprint technology and a levelling system that measures the exposure gap in real time, covering MEMS, advanced packaging and research work.
• MCS8 Manual Coating and Developing System — SUSS MicroTec: A modular manual coating and aqueous developing platform for start-ups, research groups and low volume production. Frames build up from a single module to twelve, mixing spin coating, spray coating, baking and developing on one supply and waste system.
• LP50 R&D Inkjet Printer — SUSS MicroTec: A desktop inkjet printer for developing printed material processes in the laboratory. Printheads are exchangeable and it jets solvents, photosensitive and environmentally sensitive inks for electronics, biomedical, energy and photovoltaic research.
• JETx Automated Inkjet Printer — SUSS MicroTec: An automated inkjet platform for production deposition of functional materials on wafers up to 300 mm and panels up to 24 by 30 inches. It prints up to four materials in one system and places material only where it is needed, which cuts waste.
• MaskTrack Smart BD Automated Photomask System — SUSS MicroTec: An automated bake and develop platform for photomask production down to sub 32 nm masks. Dry flip handling, a feedback loop driven by measured critical dimension data and megasonic assisted development keep results consistent across long production runs.
• Bench-top Nanoparticle Synthesis System NPS-20 — ParteQ: A turnkey bench-top flame spray pyrolysis unit for making nanoparticles at research and early development scale. Liquid precursor is sprayed into a methane and oxygen flame, and the product powder is caught on a glass microfibre filter behind the reactor.
• Filter Systems for Nanopowder Collection — ParteQ: Scalable filter systems that collect the product aerosol leaving a nanoparticle synthesis reactor. Vacuum tight flange connections allow oxygen to be excluded from the process, and filter regeneration and clean in place options can be specified.
• HMx Series Photomask Cleaning System — SUSS MicroTec: A compact manually loaded cleaning platform for photomasks and other delicate substrates, aimed at research and small series work. It brings develop, etch and cleaning steps into one cabinet, and also serves opto-electronics, OLED and semiconductor back end applications.
• MeasureReady FastHall Station — Lake Shore: The MeasureReady FastHall Station is an integrated tabletop system for Hall effect measurements. It is supplied as a single configured setup rather than a set of separate instruments, which cuts the work needed to bring a Hall measurement online. It is used for electrical characterisation of semiconductors.
• MeasureReady M91 FastHall Measurement Controller — Lake Shore: The MeasureReady M91 FastHall Measurement Controller is an instrument for Hall effect measurements on material samples. It uses Lake Shore's patented FastHall measurement technique, which shortens the time needed to complete a measurement. It is used for characterisation of semiconductors and electronic materials.
• 8400 Series HMS — Lake Shore: The 8400 Series HMS is a Hall effect measurement system that works with both DC and AC magnetic fields. It measures carrier mobility, carrier concentration density and resistivity across a wide range of sample types. It is used for research characterisation of semiconductors, including low mobility materials.
• MeasureReady M81-SSM Synchronous Source Measure System — Lake Shore: The MeasureReady M81-SSM is a synchronous source measure system for low level electrical measurements from DC to 100 kHz. It sources and measures on a shared timebase using Lake Shore's patented MeasureSync technology for accurate timing. It is used for characterisation of materials and devices.
• MagRS Magnetic Research System — Lake Shore: MagRS is a customisable electromagnet platform for material characterisation, with measurement options including VSM, Hall effect and FMR. The 4 in magnet reaches 2.61 T and the 7 in magnet 3.05 T at the smallest indexed air gap. Temperature options run from 10 K to 1273 K.
• CryoComplete Mossbauer — Lake Shore: CryoComplete Mossbauer is an integrated cryogenic Mossbauer spectroscopy system from Lake Shore and Iron Analytics. Lake Shore supply the CCS-800-205 cryostat, Model 335 controller and MeasureLINK software. Iron Analytics supply the VT5 velocity drive and TMS5 detector.
• nanoPVD-S10A Benchtop PVD System — Moorfield Nanotechnology: A compact benchtop RF and DC magnetron sputtering system for research laboratories and cleanrooms. It deposits metals, oxides, nitrides and multilayers on substrates up to 4 inches, with reactive and co-deposition options.
• nanoPVD-S10A-WA Wide-Area PVD System — Moorfield Nanotechnology: A wide area version of the benchtop nanoPVD sputtering platform for larger research substrates. It keeps RF and DC magnetron process flexibility while extending coverage to 8 inch substrates for photovoltaic, sensor and transparent conductive oxide work.
• nanoPVD-T15A Thermal Evaporation System — Moorfield Nanotechnology: A benchtop thermal and low temperature evaporation system for metals, organics and sensitive materials. It gives research groups local evaporation capability for electrodes, contact layers, organic electronics and optical films.
• nanoPVD-ST15A Hybrid PVD System — Moorfield Nanotechnology: A hybrid benchtop system that combines magnetron sputtering with thermal and low temperature evaporation in a single chamber. It suits multilayer thin films, hybrid device stacks, contacts and seed layers where the process route is not yet fixed.
• MiniLab 026 — Moorfield Nanotechnology: The most compact MiniLab modular PVD platform, designed to be glovebox compatible. It supports sputtering plus thermal and low temperature evaporation on substrates up to 6 inches, with HiPIMS and pulsed DC available by configuration.
• MiniLab 030 Compact Modular PVD System — Moorfield Nanotechnology: A compact front loading modular vacuum deposition system built on a single rack. It covers magnetron sputtering, thermal, low temperature and e-beam evaporation for metals, dielectrics and organics, and offers a glovebox mating interface.
• MiniLab 070 — Moorfield Nanotechnology: A modular PVD platform for advanced sputtering and multi-technique research. It takes up to four 3 inch sputter sources, e-beam and thermal evaporation, and supports load lock and dual chamber configurations on substrates up to 8 inches.
• MiniLab 080 — Moorfield Nanotechnology: A modular PVD system built around e-beam evaporation capability with sputtering available by configuration. It is used for solar cell, sensing and imaging research on substrates up to 8 inches, with RF and DC substrate bias.
• MiniLab 090 — Moorfield Nanotechnology: A glovebox compatible modular PVD system with front and rear door configuration, aimed at air sensitive materials and protected transfer. It is used for perovskite, OLED and organic optoelectronic thin film research.
• MiniLab 125 — Moorfield Nanotechnology: The highest capability MiniLab modular PVD platform, taking substrates up to 12 inches and up to five sputter sources. It adds nanoparticle sources, residual gas analysis, ion beam and beam assisted deposition for demanding research programmes.
• Nanoparticle System — Moorfield Nanotechnology: A nanoparticle source integrated into a Moorfield modular PVD configuration. It adds gas phase nanoparticle deposition to a conventional thin film platform for functional coatings, nanostructured films and hybrid materials.
• Small Batch Coater — Moorfield Nanotechnology: A small batch modular PVD configuration that bridges research work and pilot scale coating. It runs thermal evaporation, e-beam evaporation and magnetron sputtering with recipe driven operation and optional mask or substrate automation.
• Glovebox PVD Systems — Moorfield Nanotechnology: Glovebox integrated PVD systems for air sensitive materials and protected device workflows. Samples move between the glovebox and the deposition chamber without exposure to air, which suits perovskites, OLEDs and organic electronics.
• CVD Coating System Type CVD — FCT Systeme: A thermally induced chemical vapour deposition system for depositing uniform dielectric, semiconducting and metallic layers. Multi-zone heating with a rotating turntable and a bottom loader design suit pyrolytic carbon, silicon carbide and boron nitride coatings.
• CVI Coating System Type CVI — FCT Systeme: A chemical vapour infiltration system that infiltrates matrix material into porous or fibrous preforms to produce composite components. Switching between multiple gas inlets allows multilayer interfacial coatings on complex shapes.
• HPBC Production Line — FCT Systeme: A production line built by FCT Systeme around an automatic pass-through process, making parts to customer specification. The published page names the hot press and process technology used but carries no specification table, so no figures are quoted here.
• MA-260SH High Velocity Mossbauer Velocity Transducer — WissEl: The high velocity version of the MA-260S velocity transducer. It carries 1.5 mm multilayer guide springs in place of the standard 0.8 mm epoxy springs, which raises the resonance frequency and allows much higher source velocities with a high velocity drive unit.
• MVT-1000H High Velocity Mossbauer Velocity Transducer — WissEl: The high velocity version of the MVT-1000 velocity transducer, fitted with 1.5 mm multilayer guide springs. The stiffer springs keep the mechanical amplitude small, which is what allows source velocities above 1000 mm/s when driven by a high velocity drive unit.
• MR-260AH High Velocity Mossbauer Drive Unit — WissEl: The high velocity version of the MR-260A Mossbauer drive unit. It is built as a wider NIM module with four front panel potentiometers for the feedback loop and a rear panel fan that cools the power stage during high velocity operation.
• MR-360H High Velocity Mossbauer Drive Unit — WissEl: The high velocity version of the MR-360 Mossbauer drive unit, the model that adds a maximum velocity display. WissEl publishes it only in the list of high velocity drive units, with the shared features common to that range and no separate specification table.
• MDU-1200H High Velocity Mossbauer Drive Unit — WissEl: The high velocity version of the MDU-1200 Mossbauer drive unit, the model that supports laser calibration through the MVC-450. WissEl publishes it only in the list of high velocity drive units, with the shared features common to that range.
• TP 1200 Touch Panel Control System — Carbolite Gero: A 12 inch touch panel control system giving an overview of furnace status, built on an industrial standard Siemens PLC. A pre-program evacuates the furnace before heat treatment starts so that any errors are handled safely.
• TP 1900 Touch Panel Control System — Carbolite Gero: A 19 inch touch panel control system for fully configured furnaces and for hydrogen work above 5 per cent. It runs on a Siemens F-PLC and its pre-program carries out a fully automated leakage test in overpressure and vacuum.
• Glove Box Furnace Systems — Carbolite Gero: Customised glove box furnace systems in which a tube or chamber furnace is integrated with a glove box, so air sensitive samples can be loaded without exposure. Glove box size, air locks and glove count are built to the customer's requirement.
• Strand Line Furnaces — Carbolite Gero: Continuous heat treatment furnaces through which one or more strands of material pass for hardening and tempering. The strand runs through Inconel or ceramic tubes, and individually controlled zones hold uniformity along long heated lengths.
• Carbon Fibre Heat Treatment Furnaces — Carbolite Gero: Custom furnaces for carbon fibre research and production, covering the three stages of the process. Precursors are debound in a metal work tube, pre-sintered in a ceramic work tube, then finally sintered in a water cooled graphite heated vessel.
• Tabletop Microscope TM4000PlusII/TM4000II — Hitachi High-Tech: The TM4000II and TM4000PlusII are benchtop scanning electron microscopes for fast imaging with little sample preparation. They take specimens up to 80 mm across using backscattered electron detection, with secondary electron and mixed signal modes on the Plus model.
• Tabletop Microscope TM4000PlusIII/TM4000III — Hitachi High-Tech: The TM4000III and TM4000PlusIII are the newest benchtop scanning electron microscopes in the Hitachi TM range. They image conductive and non conductive samples using a charge up reduction mode, and take specimens up to 80 mm diameter and 50 mm thick.
• Scanning Electron Microscope FlexSEM 1000 II — Hitachi High-Tech: The FlexSEM 1000 II is a variable pressure scanning electron microscope with a tungsten filament source. It images uncoated and outgassing samples in a controlled pressure chamber, and supports energy dispersive X-ray analysis and STEM specimen holders.
• Scanning Electron Microscopes SU3800/SU3900 — Hitachi High-Tech: The SU3800 and SU3900 are variable pressure scanning electron microscopes with a five axis motorised stage and automated functions. The SU3900 carries a larger multipurpose chamber that takes specimens up to 300 mm diameter for bulky industrial samples.
• High Resolution Schottky Scanning Electron Microscope SU3900SE/SE Plus SU3800SE/SE Plus — Hitachi High-Tech: The SE Series brings Schottky field emission performance to the SU3800 and SU3900 platforms. Four models cover standard and extra large chambers, with SE Plus versions adding deceleration mode and dedicated low energy secondary electron detection.
• Schottky Field Emission Scanning Electron Microscope SU5000 — Hitachi High-Tech: The SU5000 is a Schottky field emission scanning electron microscope with an out lens objective, moving between high vacuum and variable pressure operation. Its EM Wizard interface guides imaging conditions and a drawer type stage accepts large specimens.
• Ultrahigh-Resolution Schottky Scanning Electron Microscope SU7000 — Hitachi High-Tech: The SU7000 is a Schottky field emission scanning electron microscope that collects several secondary and backscattered signals at once. Up to six channels can be displayed and stored together, and an optional variable pressure mode widens the range of samples.
• Ultrahigh-Resolution Scanning Electron Microscope SU8600 — Hitachi High-Tech: The SU8600 is a cold field emission scanning electron microscope for ultrahigh resolution imaging. An upper detector with ExB filter mixes secondary and backscattered signals, and optional detectors add cathodoluminescence and STEM capability.
• Ultrahigh-Resolution Schottky Scanning Electron Microscope SU8700 — Hitachi High-Tech: The SU8700 is a Schottky field emission scanning electron microscope offering high probe current for fast microanalysis alongside ultrahigh resolution imaging. Low landing voltage operation without stage bias suits beam sensitive specimens.
• Ultrahigh-Resolution Scanning Electron Microscope SU9600 — Hitachi High-Tech: The SU9600 is the flagship Hitachi cold field emission scanning electron microscope, built for subnanometre observation. An in lens objective and ExB detection give good signal to noise at low probe current, for semiconductor devices and advanced materials.
• Field Emission Transmission Electron Microscope HF5000 — Hitachi High-Tech: The HF5000 is a 200 kV aberration corrected TEM and STEM with a cold field emission source. A single objective lens configuration combines high specimen tilt with large solid angle EDX detection, for imaging and analysis at the atomic scale.
• Transmission Electron Microscope HT7800 Series — Hitachi High-Tech: The HT7800 Series is a 120 kV transmission electron microscope that automates routine alignment and setting. Three models trade maximum magnification against stage tilt range, covering work from life science sectioning through to materials development.
• Nanoscale Device Characteristics Analysis System Nano-Prober NP8000 — Hitachi High-Tech: The NP8000 Nano-Prober is a SEM based probing system for electrical characterisation of devices at 5 nm nodes and beyond. It supports electron beam absorbed current imaging, pulsed IV measurement and a temperature controlled stage inside the vacuum chamber.
• Focused Ion and Electron Beam System Ethos NX5000 — Hitachi High-Tech: The Ethos NX5000 combines a field emission SEM column with a gallium focused ion beam for nanoscale processing and imaging. A microsampling system with orientation control prepares uniform TEM lamellas, and a triple beam option reduces milling artefacts.
• Real-time 3D Analytical FIB-SEM NX9000 — Hitachi High-Tech: The NX9000 arranges its SEM and FIB columns orthogonally so cross sections are imaged at normal incidence. This removes foreshortening during serial sectioning and allows 3D EDS and 3D EBSD to be collected without moving the stage.
• FIB Micro-sampling System — Hitachi High-Tech: The Micro-sampling System extracts a small pillar of material from a chosen point on a wafer using the ion beam inside the vacuum chamber of a FIB system. The extracted sample is then trimmed and transferred for analysis by TEM or STEM.
• Ion Milling System ArBlade 5000 — Hitachi High-Tech: The ArBlade 5000 is a broad argon ion beam milling system that prepares cross sections and flat milled surfaces for electron microscopy. Intermittent beam irradiation and a swinging stage produce clean faces across a wide range of materials.
• Ion Milling System IM4000II — Hitachi High-Tech: The IM4000II is an argon ion milling system that carries out both cross section milling and flat milling in one instrument. Options for cooled temperature control and an air protection holder allow preparation of heat sensitive and air sensitive specimens.
• Sample Cleaner ZONESEMII — Hitachi High-Tech: The ZONESEMII is a benchtop sample cleaner that removes hydrocarbon contamination from SEM specimens and holders using vacuum controlled UV irradiation and activated oxygen. It also acts as a vacuum store to prevent holder outgassing.
• Sample Cleaner ZONETEM II — Hitachi High-Tech: The ZONETEM II is a desktop sample cleaner for TEM specimens. It uses vacuum controlled UV irradiation to remove hydrocarbon contamination from the sample surface before imaging, without the use of chemicals, supply gases or reagents.
• Auto Capture for Array Tomography ACAT — Hitachi High-Tech: ACAT is an automated image acquisition option for serial section analysis on Hitachi field emission SEMs. It aligns and captures a chosen region of interest across many consecutive sections, correcting for rotation, compression and tears so array tomography runs without operator input.
• MirrorCLEM System for Correlative Light and Electron Microscopy — Hitachi High-Tech: MirrorCLEM correlates specimens between optical and electron microscopes. A specimen imaged on any light microscope is transferred to the Hitachi SEM stage, where the optical image acts as an anchor map that drives the stage to a chosen region and overlays both images in real time.
• Ultim Max Infinity — Oxford Instruments: Ultim Max Infinity is the Oxford Instruments silicon drift detector range for energy dispersive X-ray analysis in the SEM. Sensor sizes from 40 to 170 square millimetres all give the same analytical performance, with a motorised slide for insertion and retraction.
• Ultim Extreme Infinity — Oxford Instruments: Ultim Extreme Infinity is a windowless energy dispersive X-ray detector for ultra high resolution field emission SEM. Its shaped sensor sits close to the sample at very short working distance, so elemental analysis can be run at the low kV used for nanomaterials and surfaces.
• Xplore — Oxford Instruments: Xplore is a compact energy dispersive X-ray detector for routine microanalysis in the SEM. It uses the same X4 electronics as the larger Ultim Max Infinity detectors in a smaller package, with motorised insertion and extra cooling removed to reduce parts and allow in field repair.
• XploreCompact for TTM — Oxford Instruments: XploreCompact is an energy dispersive X-ray detector sized to fit inside the outer casing of a table top microscope with no cut outs. It carries the same detector technology as the larger Ultim Max range, bringing AZtecLive real time chemical imaging to benchtop SEMs.
• Unity — Oxford Instruments: Unity is a combined backscattered electron and X-ray detector for the SEM. Both sensor types sit in one package directly beneath the pole piece, which raises X-ray sensitivity and removes the shadowing that affects conventional detectors on rough and unpolished samples.
• Symmetry S3 — Oxford Instruments: Symmetry S3 is an all in one electron backscatter diffraction detector built on a CMOS sensor with lens free fibre optic coupling. It combines high indexing speed with the sensitivity needed for low energy and low current work, and the detector tilt is controlled from software.
• C-Nano+ — Oxford Instruments: C-Nano+ is an entry level electron backscatter diffraction detector using a customised CMOS sensor. Its high pixel resolution suits detailed strain analysis, and the lens free fibre optic design gives the sensitivity needed for beam sensitive and nanocrystalline materials.
• C-Swift+ — Oxford Instruments: C-Swift+ is a high speed entry level electron backscatter diffraction detector for routine materials analysis and high throughput characterisation. It uses a customised CMOS sensor with fibre optics, and can trade speed for pattern quality on complex multi phase samples.
• OmniProbe — Oxford Instruments: OmniProbe nanomanipulators are used for lift out work in FIB and SEM systems, mainly TEM lamella preparation. The ninth generation units run on piezoelectric motors under closed loop control, and the port mounted design keeps clear of other detectors and accessories.
• OmniProbe 350 Cryo lift-out — Oxford Instruments: The cryo lift out option extends OmniProbe lift out to cryogenic samples, including those made by high pressure freezing. A custom probe shaft with a thermally isolated tip is cooled passively from the cryo system cold finger, opening up cryo-TEM and cryo atom probe work.
• Horizon 10k Ion Polisher — Oxford Instruments: The Horizon 10k Ion Polisher uses an argon plasma to etch and prepare flat and cross sectional samples for microscopy. A cooling stage limits thermal damage, and recipe based operation with simple sample mounting keeps preparation repeatable on soft and difficult materials.
• inLux SEM Raman interface — Renishaw: An interface that brings Raman, photoluminescence and cathodoluminescence analysis into a scanning electron microscope chamber. The sample stays still between SEM imaging and Raman collection, so the two data sets are co-located, and the probe retracts with a single click.
• XL-80 laser interferometer system — Renishaw: A laser interferometer for measuring and calibrating motion systems, machine tools and coordinate measuring machines. It measures linear, angular, rotary, straightness and squareness errors directly, giving traceable data that can be used to set machine compensation.
• XK20 alignment laser system — Renishaw: Renishaw's second generation alignment laser system for machine build and service. It measures straightness, parallelism, squareness and level on linear and rotary axes, and reports to ISO 230-11 through the CARTO XK20 app, which also carries ISO 10791 and 3070 tolerances.
• XK10 alignment laser system — Renishaw: A digital alignment laser system used to measure and adjust geometric and rotational errors while a machine is being built or serviced. It replaces dial gauges, autocollimators and metrology artefacts for checking that rails are straight, square, flat, parallel and level.
• RLE fibre optic laser encoder system — Renishaw: A homodyne laser interferometer system for position feedback, made up of an RLU laser unit and one or two RLD10 detector heads. Fibre optic delivery keeps heat away from the axis, which suits semiconductor stages and other high precision positioning work.
• ExactCut 430 — Coherent: The ExactCut 430 is a precision laser cutting system for automated processing of thin and thick metals and alloys, plus brittle materials such as sapphire, PCD and ceramics. It runs a pulsed infrared fibre laser at 150 W or 300 W and holds XY positioning accuracy of +/-0.002 mm.
• StarCut Tube — Coherent: StarCut Tube are fully automated multi-axis CNC laser cutting machines for tubes and flat materials, including catheter shafts, stents and hypotubes. Contour cutting accuracy is better than +/-5 um. The L 600 model takes a fibre laser, an ultrashort pulse laser or both.
• PowerLine FL — Coherent: PowerLine FL are single mode fibre laser sub-systems with optional focusing heads and galvo scanners for welding or cutting. Output runs from 200 W to 1500 W, with CW and pulsed operation from single shot to 5 MHz and working areas from 55 x 55 mm to 260 x 260 mm.
• PowerLine AVIA NX — Coherent: PowerLine AVIA NX is an ultraviolet laser cutter for integration into existing handling systems for cutting, drilling and scribing wafers, SIPs, packages and PCBs. It pairs a 355 nm AVIA laser with a galvanometer scanner, optics and software that can cover a 300 mm wafer.
• PowerLine C — Coherent: PowerLine C is a CO2 laser based tool for precision drilling, cutting, scribing, marking and engraving of non-metals including glass and organic materials. Three power levels and three wavelengths are offered, with 2 axis or 3 axis scanner control and StarFlex software.
• LFS/QFS with FLBK SC — Coherent: LFS and QFS with FLBK SC are fibre laser systems for scribing combustion engine connecting rods ahead of hydraulic cracking. The QFS uses a 50 W nanosecond fibre laser and the LFS a 150 W millisecond fibre laser, and both are built to integrate into a production line.
• NA Needle Drilling System — Coherent: The NA Needle Drilling System drills blind holes in surgical suture needles. Each hole is drilled with a single shaped long pulse, giving smooth features and minimal thermal damage. It is optimised for holes of 50 to 750 um diameter at aspect ratios as high as 10:1.
• eM100 Micromachining System — Coherent: The eM100 is a micromachining system for shaping fine details in superhard materials such as tungsten carbide, advanced ceramics, silicon carbide and boron nitrides. It uses a 100 W infrared nanosecond fibre laser with galvo scanning, and can also cut thinner materials and mark surfaces.
• L45/L60 PCD Surface Lapping/Shaping Tools — Coherent: The L45 and L60 are laser tools for lapping and shaping polycrystalline diamond disks used in cutting tools and in oil and gas parts. The L45 handles fine and coarse lapping, while the L60 adds beveling, rounding and profiling with no need for pre-lapping.
• eM15 Monocrystalline Diamond Cutting System — Coherent: The eM15 cuts natural and synthetic monocrystalline diamond and CVD wafers with a pulsed green laser, giving deep cuts with low taper. It replaces slow sawing for windows, heat sinks, precision tooling, acoustic wave devices and jewellery.
• Q60 — Coherent: The Q60 cuts polycrystalline diamond, cubic boron nitride and carbides with a 600 W fibre laser. It is offered as a three axis Q60-3x plus four and five axis models, all using coaxial video and machine vision monitoring with eMicro control software.
• ExactMark Laser Marking Systems — Coherent: ExactMark are laser marking systems with a motorised z axis for automatic focusing plus optional motion axes, laser types and automation tools. Four models cover economical marking, tray loaded automation, marking of metals and plastics, and black marking with an ultrashort pulse laser.
• PowerLine Series — Coherent: PowerLine Series are laser marking and engraving sub-systems that combine a laser with focusing and scanning optics and software. The range covers CO2, solid state infrared, green and ultraviolet, air cooled fibre and ultrashort pulse sources for 3D marking, on the fly marking and serialisation.
• EasyMark Series — Coherent: EasyMark are self-contained table-top laser marking systems for manual loading, used for marking, annealing, engraving and cutting. Three models offer fibre laser options up to 50 W with marking areas of 120 x 120 mm or 240 x 240 mm in a Class I enclosure.
• AP 530 — Coherent: The AP 530 is an automated laser system for marking and surface texturing of medical devices. It combines multi-axis robotic part handling, machine vision and a choice of laser source. The M model handles tubular parts and the S model free-form implants.
• CombiLine Series — Coherent: CombiLine are configurable laser marking systems with a motorised z axis for automatic focusing and optional motion axes. Two heavy duty models are offered with work table or dial table setups, sized for standing or seated operators.
• LabelMarker Advanced — Coherent: LabelMarker Advanced is an integrated system for marking and kiss cutting of labels, handling common laser label materials including foil processing and singulation. Four PowerLine laser choices are offered at 1064 nm from 25 W to 50 W, with VLM design software.
• LME Series — Coherent: LME Series are laser marking workstations for precision part marking in production, used in medical and automotive manufacturing. Three models take different workpiece sizes and part motion options, and all use air cooled PowerLine laser sources.
• ExactWeld — Coherent: ExactWeld systems perform automated precision welding of small metal parts for medical products, automotive electronics and sensors. Each combines a fibre laser, robotic positioning, software and an optional vision system, with galvanometer scanning for welds over complex contours.
• HighLight Weld — Coherent: HighLight Weld are configured fibre laser welding solutions that integrate a laser source, process fibre, scanner, process optics, cooling and control electronics. Lasers of up to 10 kW can be paired with a choice of scanner platforms, focusing optics and working magnifications.
• Manual Welding Systems — Coherent: Coherent manual welding systems combine an Nd:YAG or fibre laser, a laser safe work chamber, a microscope viewer and a control interface. They produce spot and seam welds at micron level precision for medical device manufacture, jewellery, general manufacturing and mould repair.
• MPS Series — Coherent: MPS Series are modular integrated systems for laser welding, cutting, structuring and drilling, including ultrashort pulse applications. Four systems, Compact, Flexible, Rotary and Advanced, offer different beam scanning modules and multi-axis part motion options.
• Profile Welding System (PWS) — Coherent: The Profile Welding System combines a CO2 or fibre laser with process sensors, precision motion and control software for tube and profile welding. An integrated process sensor detects and tracks the welding gap, and precision linear actuators position the beam at speeds of up to 60 m/min.
• SLS200 CL Pulsed Laser Welder — Coherent: The SLS200 CL integrates a lamp pumped pulsed Nd:YAG laser with a beam delivery fibre, optics, control electronics and software. Paired with an LLBK processing head it performs spot and seam welding of thin, delicate or heat sensitive metals over a wide power range.
• GeoLasGC — Coherent: GeoLasGC is a laser ablation system for LA-ICP-MS elemental and isotopic analysis. It combines a 193 nm COMPex excimer laser, a polarised microscope, HD camera observation and a dual volume sample cell, and is used for isotope ratios, fluid inclusion work and zircon age dating.
• LineBeam — Coherent: LineBeam systems deliver line beam profiles for excimer laser annealing of low temperature polysilicon backplanes on large display substrates. Line lengths run from 750 mm to 1500 mm at 308 nm or 355 nm, with top hat profiles along both axes.
• UVblade — Coherent: UVblade uses 308 nm excimer pulses to detach polymer based flexible displays from rigid glass carriers in a laser lift-off process. Three models cover beam lengths of 380 mm, 750 mm and 1250 mm with a top hat line beam and a large depth of focus.
• UVtransfer — Coherent: UVtransfer systems are 248 nm excimer laser tools for microLED display production. The 3-in-1 system performs laser lift-off, laser induced forward transfer and pixel repair for development work, while UVtransfer and UVtransfer R are production LIFT and repair tools.
• VarioLas — Coherent: VarioLas systems are built around the COMPex excimer laser for ultraviolet microprocessing with a line beam or square beam field shape. They are used for laser lift-off separation, dopant ion activation, ablative patterning and thin film annealing.
• THz-Raman Integrated Systems — Coherent: THz-Raman Integrated Systems are turnkey Raman platforms that record the low frequency and fingerprint regions in one measurement. The TR-WPS is a microplate reader with intra-well mapping and the TR-WALDO adds upright and inverted microscopy with translation stages.
• THz-Raman Modular Systems — Coherent: THz-Raman Modular Systems upgrade an existing spectrometer so it can collect the low frequency Raman region from about 5 to 150 cm-1. Each module includes the laser and the filters needed to produce a clean spectrum to within about 5 cm-1, with a fibre optic output to the spectrometer.
• ACE Fiber Laser — Coherent: ACE FL is a 1940 nm fibre laser for urology procedures such as lithotripsy and for materials processing including clear polymer welding. Four models cover 75 W to 300 W nominal average power with air or water cooling and a flat top beam mode.
• AIM Fiber Laser — Coherent: AIM FL are multi-kilowatt single mode fibre lasers for precision welding and handheld laser welding. Five models cover 0.5 kW to 3 kW, all with a beam parameter product below 0.4 mm x mrad at 20 um and a 10 m supplied process fibre.
• ARM Fiber Laser — Coherent: ARM fibre lasers use an adjustable ring mode beam with a centre beam and a coaxial ring beam under independent power and modulation control. That control suits welding of heat sensitive materials, dissimilar materials, cast aluminium and copper.
• Edge Fiber Laser — Coherent: EDGE FL are multi-kilowatt fibre lasers for metal cutting, offered from 1.5 kW to 30 kW in rack mount and cabinet versions. They pair with Coherent CUT process heads and ship with a 25 m process fibre.
• HighLight Fiber Laser — Coherent: HighLight FL are industrial multi-kilowatt fibre lasers for welding, with detachable process fibres for operational flexibility. A multi-stage back reflection immunity system allows safe processing of highly reflective materials such as brass, copper and aluminium.
• Fiber-Coupled Diode Lasers — Coherent: These are fibre pigtailed diode lasers supplied with one metre of standard or custom fibre, including single mode, multi-mode and polarisation maintaining types. Available wavelengths include 405, 440, 515, 520, 532, 635, 660, 785, 808 and 1064 nm, with dual colour fibre combiners on request.
• BeamMaster-USB System — Coherent: BeamMaster-USB is a scanning multiple knife-edge beam profiler for continuous wave lasers. Its large dynamic range lets it measure small diameter and focused beams from 3 um to 8 mm across a wavelength range of 190 nm to 1800 nm.
• ENVIRO-MATRIX Trinity — Semian: Point of use abatement system for PFC, SiF4 and acid gases from etch and CVD tools. A first water scrubber removes acid gases, a catalytic reactor breaks down the PFCs, and a second water scrubber removes the HF produced.
• ENVIRO-MATRIX Infinity — Semian: Point of use system combining a pyrophoric oxidation chamber with multistage wet scrubbing, for silicon nitride deposition and interlayer dielectric exhaust. Gases stay dry until the wet stage, which keeps the inlet port clear of deposits.
• ENVIRO-MATRIX Cyrus — Semian: Dry adsorption system that removes and concentrates highly toxic compounds such as arsine, phosphine and germane from semiconductor effluent. Media can also be specified for organic compounds, high molecular weight VOCs, acid gases and ammonia.
• ENVIRO-MATRIX Sentinel — Semian: Point of use wet scrubber range for semiconductor reactor effluent containing corrosive, toxic or reactive gases. It handles solids generating gases such as WF6, BCl3 and DCS, and is normally installed in the sub fab or cleanroom chase.
• ENVIRO-MATRIX Altair — Semian: Passive gas treatment device for semiconductor process tool effluent, working without fuel gas or other utilities. It draws room air through the existing scrubber or ventilation system, which keeps running cost and maintenance time low.
• ACM 150G2 Gas Monitoring System — Honeywell: FTIR based gas monitoring system for semiconductor and industrial process exhaust. The redesigned bench lowers the detectable limit for many gases, and the operator interface shows proof of response for each measurement point.
• Vertex™ Edge Toxic gas monitoring system — Honeywell: Centralised Chemcassette monitoring cabinet holding up to nine analysers, each with eight points of detection. It covers virtually every gas used in a semiconductor fab down to parts per billion, with gas readings, alarms and events on one screen.
• Vertex™ Multi-Point Toxic Gas Monitoring System — Honeywell: Continuous Chemcassette monitoring system scaling to 72 points of gas detection. Analysers, optics and software are combined in one cabinet so a fab can start small and add points as the monitoring requirement grows.
• Vertex™ M Toxic Gas Monitoring System — Honeywell: Chemcassette monitoring system covering eight to 24 points of continuous gas detection, with built in redundancy to protect against downtime. Sampling points can be added as monitoring needs change without replacing the cabinet.
• OmniProbe 400 — Oxford Instruments: Now in its ninth generation, this nanomanipulator applies piezo actuation to nanoscale positioning in the FIB and SEM, offering four degrees of freedom in X, Y, Z and R with 4 mm or more of working distance. Nanometre-resolution piezo actuators paired with 10 nm closed-loop encoders deliver precision, linearity and smooth motion, and closed loop control lets the operator navigate to stored positions and move orthogonally at any sample tilt. Motorised concentric rotation and in situ tip changes come as standard, so probe needles can be swapped in under 3 minutes without venting the microscope. Insertion and retraction are non-pneumatic, which is gentle on fragile samples.
• Ultim Max TLE — Oxford Instruments: Ultim Max TLE is the Oxford Instruments flagship silicon drift detector for the TEM, optimised for elemental characterisation at the atomic scale with maximum count rates at the smallest probe sizes. Its performance comes from an optimised sensor shape, a 100 mm2 sensor, windowless construction, an optimised mechanical design and Extreme electronics. The detector is also aimed at biological sample analysis, where it collects data quickly and accurately on beam sensitive samples by maximising the count rate of low energy X-rays. Extreme electronics combined with the X4 pulse processor allow in situ EDS mapping and quantification at elevated temperatures.
• Ultim Max TEM — Oxford Instruments: Ultim Max TEM is the Oxford Instruments silicon drift detector for nanoscale analysis and elemental mapping in the TEM. A low profile 80 mm2 sensor sits closer to the specimen and so collects more X-ray counts under any condition, and combined with windowless construction and Extreme electronics it delivers high performance EDS for 200kV instruments. An increased solid angle and take off angle reduce shadowing by bulky in situ holders, which supports mapping of samples in gas or liquid cells.
• Xplore TEM — Oxford Instruments: Xplore TEM is the Oxford Instruments silicon drift detector aimed at routine work on 120kV and 200kV transmission electron microscopes. It combines an 80 mm2 sensor with a polymer thin window and Extreme electronics for fast, accurate elemental characterisation. The SATW window keeps the detector straightforward to use, and element coverage runs from beryllium to californium.
• TM Series Energy Dispersive X-ray Spectrometer: Element series — Hitachi High-Tech: The Element series are EDX systems for Hitachi's TM series tabletop microscopes, produced by EDAX Instruments. A Si3N4 detector window optimises low energy X-ray transmission for light element analysis, which Hitachi say improves mapping speed and detection limits over a conventional detector window, and a hexagonal support grid raises transmission further. APEX software supplies multi user logins, user configurable windows, customisable reporting, simplified automation, fast mapping, simultaneous collection and review, and spectrum match libraries. The sample configuration shown is in combination with a TM4000 series instrument.
• TM Series Energy Dispersive X-ray Spectrometer: Quantax75 — Hitachi High-Tech: Quantax75 is one of the EDS systems Hitachi offer with the TM4000 series tabletop microscopes, using a built-in detector made by Bruker Nano GmbH. Hitachi note that every detector in this range is of compact design and needs no liquid nitrogen. The system gives local spectra observation at specified points, high speed colourised X-ray mapping, a hypermap function that returns spot analysis, line analysis and mapping results from a single acquisition, and live deconvolution so that overlapping peaks are separated and mapped in real time.
• TM Series Energy Dispersive X-ray Spectrometers: AZtec Series — Hitachi High-Tech: The AZtec series gives the TM series tabletop microscopes a choice of EDS systems, with built-in detectors made by Oxford Instruments and an energy resolution of 129 eV (Mn-Ka) available in all classes. Hitachi list three configurations: AZtecOneXplore as standard, AZtecLiveOneXplore with the live EDS function, and AZtecLiveLite as the multi-featured analysis instrument. The TruMap feature separates multi element spectra and subtracts background in real time so that element maps are free of contamination from overlapping peaks, while pile-up correction and TruQ technologies support high throughput analysis. AZtecLiveLite adds large area mapping and particle analysis through a motorised stage.

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