SUSS MicroTec in Bangladesh

Explore 33 unique SUSS MicroTec catalogue listings across Nanotechnology. Compare equipment and manufacturer references, then request a quotation for the model, accessories, delivery and support you need.

Plan your purchase: lithography and wafer bonding

Start with the application and the equipment already in use. These details help the team identify a suitable configuration and an itemised quotation.

Useful details for your quotation

Substrate material, dimensions and process
Resolution, alignment and bonding requirements
Resist, masks, utilities and facility readiness
Quantities, delivery location and required date
Installation, training, warranty and service requirements

Confirm the exact model, compatible accessories, documentation, current availability and delivery terms in writing. The catalogue describes equipment options; installation, acceptance and ongoing support are agreed for the proposed configuration.

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Products

MA/BA Gen4 Series Mask and Bond Aligner: A semi-automated mask aligner and imprint platform for contact and proximity lithography. It exposes photoresist through a physical mask and also runs UV nanoimprint, serving MEMS and NEMS, advanced packaging, micro-optics and compound semiconductor work in research and pilot production.
MJB4 Manual Mask Aligner: A compact manual mask aligner for research and small volume production. It takes pieces from 5 by 5 mm up to 100 mm wafers, prints in soft, hard and vacuum contact, and also supports UV nanoimprint lithography on fragile materials.
MA300 Gen3 Mask Aligner: An automated mask aligner for 200 mm and 300 mm wafers in advanced packaging. It patterns through silicon vias, redistribution layers and bumping levels by proximity lithography, and copes with thick resist films that fall outside stepper capability.
MA200 Gen3 Mask Aligner: A fully automated mask aligner for high volume production of wafers and square substrates up to 200 mm. It pairs DirectAlign alignment with MO Exposure Optics illumination and ThermAlign thermal compensation for MEMS, radio frequency and power device manufacturing.
NIL-SFT12 Series Stamp Fabrication Tool: A stamp fabrication tool that replicates working stamps for nanoimprint lithography on 300 mm substrates. UV and thermal stamp making sit in one frame, and the high UV irradiance shortens replication from hours to minutes with tight critical dimension control.
NIL-SFT8 Series Stamp Fabrication Tool: A table-top tool that makes working stamps for micro and nanoimprint lithography, sized to match the 8 inch MA/BA Gen4 mask aligners. UV-LED curing cuts stamp replication from hours to minutes for LED, MEMS, micro-optics and augmented reality applications.
DSC300 Gen3 Projection Scanner: An automated projection lithography scanner for advanced packaging on 300 mm and 200 mm wafers. Wynne-Dyson optics print 2 µm lines and spaces with a large depth of focus, and the stitchless full field scan removes step field size limits on the layout.
LabSpin Series Spin Coater and Developer: A manual bench-top spin coater and developer for photolithography in laboratories. It spreads resist and other chemicals evenly over round or square substrates, and can be fitted with dispense, edge bead removal, puddle developer and nitrogen drying options.
RCD8 Semi-Automated Coater and Developer: A semi-automated resist coating and developing module for wafers up to 200 mm. It suits research and small scale production, handling everything from very thin films to highly viscous thick resists, and runs alone or inside a SUSS LabCluster.
HP8 Hot Plate for Manual Coating: A compact manual hot plate for the soft bake, post exposure bake and hard bake steps of a research coating line. It takes round substrates up to 200 mm or 6 inch squares and uses coil heating with three lifting pins for handling.
ECD8 Semi-Automated Coater or Developer: A compact semi-automated spin coater or developer for substrates up to 200 mm. It has an integrated media cabinet, a transparent hood that keeps the process in view and one-hand wafer centring, and is configured either as a coater or as a developer.
AS8 Manual Spray Coater for High Topographies: A manual spray coater that lays resist over deep three dimensional structures where spin coating cannot reach. Programmable spray and cleaning paths give even edge coverage without resist pooling in trenches, on substrates up to 200 mm.
ACS300 Gen2 Automated Coater and Developer: A fully automated cluster coater and developer for 200 mm and 300 mm wafers. Coating, baking and developing modules share one frame, so both wafer sizes run without mechanical changeover, from pilot lines through to high volume manufacturing.
ACS200 Gen3 Automated Coater and Developer: An automated cluster coater and developer for wafers from 100 mm to 200 mm. Modular frames scale from research use up to high volume manufacturing, and the GYRSET closed cover method holds a solvent rich layer over the wafer for stable film thickness.
ACS200 Gen3 TE Automated Coater and Developer: A throughput enhanced version of the ACS200 Gen3 cluster coater and developer for wafers from 100 mm to 200 mm. Up to six spinner modules can be fitted, and special tooling handles warped, ultra-thin and stacked wafers used in advanced packaging.
ASx Series Photomask Processing Platform: An automated photomask processing platform that carries out advanced bake, resist strip, clean and develop steps in one system. A 25 zone hotplate holds the bake temperature closely, which is what sets critical dimension uniformity on advanced masks.
MaskTrack Pro Series Photomask Cleaning Platform: A photomask cleaning and processing platform built for extreme ultraviolet lithography, 193i immersion work at 1x nm half-pitch and nanoimprint masks. The modular frame can be clustered with third party tools so storage, handling and processing stay in one controlled environment.
MA12 Gen3 Semi-Automated Mask Aligner and Imprint System: A semi-automated mask aligner and imprint tool for wafers up to 300 mm. It combines full field UV exposure with SMILE imprint technology and a levelling system that measures the exposure gap in real time, covering MEMS, advanced packaging and research work.
MCS8 Manual Coating and Developing System: A modular manual coating and aqueous developing platform for start-ups, research groups and low volume production. Frames build up from a single module to twelve, mixing spin coating, spray coating, baking and developing on one supply and waste system.
LP50 R&D Inkjet Printer: A desktop inkjet printer for developing printed material processes in the laboratory. Printheads are exchangeable and it jets solvents, photosensitive and environmentally sensitive inks for electronics, biomedical, energy and photovoltaic research.
JETx Automated Inkjet Printer: An automated inkjet platform for production deposition of functional materials on wafers up to 300 mm and panels up to 24 by 30 inches. It prints up to four materials in one system and places material only where it is needed, which cuts waste.
MaskTrack Smart BD Automated Photomask System: An automated bake and develop platform for photomask production down to sub 32 nm masks. Dry flip handling, a feedback loop driven by measured critical dimension data and megasonic assisted development keep results consistent across long production runs.
HMx Series Photomask Cleaning System: A compact manually loaded cleaning platform for photomasks and other delicate substrates, aimed at research and small series work. It brings develop, etch and cleaning steps into one cabinet, and also serves opto-electronics, OLED and semiconductor back end applications.
SB8 Gen2 Wafer Bonder: A semi-automated universal wafer bonder for substrates up to 200 mm. It runs fusion, eutectic, diffusion, anodic and adhesive bonding under force and heat, and its sequential spacer removal withdraws each spacer separately before the wafers meet.
XB8 Wafer Bonder: A semi-automated wafer bonder with a closed process chamber for bond stacks up to 200 mm. Automatic loading with nitrogen purge, dual zone ceramic heating and three zone force control support anodic, fusion, eutectic, glass frit and metal diffusion bonding.
XBS200 Wafer Bonder: A fixture-less automated permanent bonder for wafer sizes up to 200 mm, aimed at volume production of MEMS, LED and 3D advanced packaging. Dropping mechanical fixtures gives flexible handling and lets spacing and vacuum conditions be logged digitally.
XBS300 W2W Hybrid Bonding Platform: An automated hybrid bonding platform for wafer to wafer and collective die to wafer stacking on 200 mm and 300 mm wafers. Surface activation, metrology and bonding sit in one cluster for 3D stacked memory and 3D system on chip devices.
XBC300 Gen2 SP Surface Preparation Cluster: A surface preparation cluster for hybrid bonding that cleans and activates wafers without an integrated bonder, so it can feed stand-alone bonding tools. It combines aqueous cleaning, vacuum plasma activation and in-line infrared void metrology.
XBC300 Gen2 D2W Wafer Bonder: An automated sequential die to wafer hybrid bonder that places and bonds individual dies onto a target wafer. Surface activation, die placement and metrology are integrated in one frame for high bandwidth memory and other 3D integrated circuit stacks.
XBC300 Gen2 D2W/W2W Hybrid Bonding Platform: A hybrid bonding cluster that covers wafer to wafer, collective die to wafer and sequential die to wafer processes on one platform. Built with SET Corporation SA, it targets research and pilot lines that later scale into volume production.
DB12T Debonder: A mechanical peel-off debonder that separates support carriers from tape mounted wafers at room temperature. A dedicated roller controls the debond wave front, and force, speed and blade insertion height are all set electronically.
XBS300 Temporary Bonding Platform: A temporary bonder for 200 mm and 300 mm wafers built for volume manufacturing. Its modular frame accepts commercially available temporary bonding adhesives on silicon or glass carriers, and an on-board metrology module checks alignment during the run.
XBC300 Gen2 Debonder and Cleaner: A modular debonding and cleaning cluster for tape mounted wafers and carriers at 200 mm, 300 mm and oversized formats. Mechanical peel-off and laser debonding modules can be combined with cleaning modules for thinned or full thickness wafers.

SUSS MicroTec equipment: purchase questions

Which SUSS MicroTec equipment can I find here?

This VVON catalogue covers lithography and wafer bonding. Use the category filter or search a product or model, then open the product page for its description and manufacturer reference. Catalogue entries do not establish current local stock or every product in the manufacturer's worldwide range.

What details help prepare a SUSS MicroTec quotation?

Include: Substrate material, dimensions and process; Resolution, alignment and bonding requirements; Resist, masks, utilities and facility readiness. Add the quantities, delivery location and required date. You can add several products to one enquiry list or request help selecting the configuration.

What affects SUSS MicroTec equipment pricing in Bangladesh?

Wafer or substrate format, alignment requirements, process modules, tooling and software determine the package. Include cleanroom interfaces, utilities, installation and process training in the comparison. Request a dated, itemised quotation stating currency, taxes, delivery, warranty and service responsibilities. A catalogue listing is not a current price or local-stock commitment.