Brand: Oxford Instruments | Category: Nanotechnology
The PlasmaPro 100 Cobra ICP RIE uses a high density inductively coupled plasma for fast etch rates with independent control of substrate bias. It handles wafers up to 200 mm and serves GaAs and InP optoelectronics, microLEDs, SiC and GaN power devices and MEMS.
| Parameter | Value |
|---|---|
| Wafer size | up to 200 mm |
| ICP source sizes | 65 mm and 300 mm |
| Electrode temperature range | -150 °C to 400 °C |
| Specification | Clusters with up to 5 process modules |
| Specification | Transition from 20 °C to -150 °C in as little as 10 minutes |
| Specification | Wafer clamping with helium backside cooling |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for Oxford Instruments.
Phone: +880 1711-738207 | Email: info@vvon.com.bd