Brand: Oxford Instruments | Category: Nanotechnology
The PlasmaPro 100 RIE delivers isotropic and anisotropic dry etching across a wide process range. A single RF plasma source sets both ion density and energy, with load lock and cassette to cassette options for repeatable research and production work up to 200 mm.
| Parameter | Value |
|---|---|
| Operating pressure | 5 to 500 mTorr |
| Power density | 0.1 to 1.5 W/cm2 |
| Total gas flow | 5 to 200 sccm |
| DC bias generated on lower electrode | 30 to 800 V |
| Electrode temperature range | -150 °C to 400 °C |
| Specification | Clusters with up to 4 process modules |
Contact Vvon Technologies Limited about Oxford Instruments equipment requirements in Bangladesh.
Phone: +880 1711-738207 | Email: info@vvon.com.bd
The PlasmaPro 100 Estrelas creates deep, steep sided trenches and vias in silicon. It runs both Bosch and cryogenic processes in the same chamber, covering high rate cavity etches, high aspect ratio features and tapered vias for MEMS and advanced packaging.
A PlasmaPro 100 Cobra configuration set up for volume VCSEL manufacture. The process gives a clean mesa sidewall finish, controlled profile angle for critical dimension control and very low footing, working with either photoresist or a hard mask.
The PlasmaPro 100 PECVD deposits dielectric and silicon based films with control of refractive index, stress, electrical properties and wet chemical etch rate. Dual frequency power applied to the showerhead electrode allows stress control and film densification.