Wafer Bonding in Bangladesh

SUSS MicroTec permanent and temporary wafer bonding and debonding platforms for MEMS and advanced packaging.

10 products from 1 manufacturer: SUSS MicroTec.

Products

• SB8 Gen2 Wafer Bonder — SUSS MicroTec: A semi-automated universal wafer bonder for substrates up to 200 mm. It runs fusion, eutectic, diffusion, anodic and adhesive bonding under force and heat, and its sequential spacer removal withdraws each spacer separately before the wafers meet.
• XB8 Wafer Bonder — SUSS MicroTec: A semi-automated wafer bonder with a closed process chamber for bond stacks up to 200 mm. Automatic loading with nitrogen purge, dual zone ceramic heating and three zone force control support anodic, fusion, eutectic, glass frit and metal diffusion bonding.
• XBS200 Wafer Bonder — SUSS MicroTec: A fixture-less automated permanent bonder for wafer sizes up to 200 mm, aimed at volume production of MEMS, LED and 3D advanced packaging. Dropping mechanical fixtures gives flexible handling and lets spacing and vacuum conditions be logged digitally.
• XBS300 W2W Hybrid Bonding Platform — SUSS MicroTec: An automated hybrid bonding platform for wafer to wafer and collective die to wafer stacking on 200 mm and 300 mm wafers. Surface activation, metrology and bonding sit in one cluster for 3D stacked memory and 3D system on chip devices.
• XBC300 Gen2 SP Surface Preparation Cluster — SUSS MicroTec: A surface preparation cluster for hybrid bonding that cleans and activates wafers without an integrated bonder, so it can feed stand-alone bonding tools. It combines aqueous cleaning, vacuum plasma activation and in-line infrared void metrology.
• XBC300 Gen2 D2W Wafer Bonder — SUSS MicroTec: An automated sequential die to wafer hybrid bonder that places and bonds individual dies onto a target wafer. Surface activation, die placement and metrology are integrated in one frame for high bandwidth memory and other 3D integrated circuit stacks.
• XBC300 Gen2 D2W/W2W Hybrid Bonding Platform — SUSS MicroTec: A hybrid bonding cluster that covers wafer to wafer, collective die to wafer and sequential die to wafer processes on one platform. Built with SET Corporation SA, it targets research and pilot lines that later scale into volume production.
• DB12T Debonder — SUSS MicroTec: A mechanical peel-off debonder that separates support carriers from tape mounted wafers at room temperature. A dedicated roller controls the debond wave front, and force, speed and blade insertion height are all set electronically.
• XBS300 Temporary Bonding Platform — SUSS MicroTec: A temporary bonder for 200 mm and 300 mm wafers built for volume manufacturing. Its modular frame accepts commercially available temporary bonding adhesives on silicon or glass carriers, and an on-board metrology module checks alignment during the run.
• XBC300 Gen2 Debonder and Cleaner — SUSS MicroTec: A modular debonding and cleaning cluster for tape mounted wafers and carriers at 200 mm, 300 mm and oversized formats. Mechanical peel-off and laser debonding modules can be combined with cleaning modules for thinned or full thickness wafers.

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