Brand: SUSS MicroTec | Category: Nanotechnology
A semi-automated universal wafer bonder for substrates up to 200 mm. It runs fusion, eutectic, diffusion, anodic and adhesive bonding under force and heat, and its sequential spacer removal withdraws each spacer separately before the wafers meet.
| Parameter | Value |
|---|---|
| Wafer size | up to 200 mm |
| Bond force | 300 N to 20 kN |
| Temperature range | 30 °C to 500 °C on the tooling plate |
| Temperature ramp | up to 30 K/min |
| Footprint | 1.2 m x 0.6 m |
| Processes | fusion, eutectic, diffusion, anodic and adhesive bonding |
Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +880 1711-738207 | Email: info@vvon.com.bd
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