Brand: SUSS MicroTec | Category: Nanotechnology
A compact manual mask aligner for research and small volume production. It takes pieces from 5 by 5 mm up to 100 mm wafers, prints in soft, hard and vacuum contact, and also supports UV nanoimprint lithography on fragile materials.
| Parameter | Value |
|---|---|
| Substrate range | pieces from 5 x 5 mm up to 100 mm wafers |
| Substrate thickness | up to 4 mm |
| Resolution | from 2 µm down to less than 0.5 µm |
| Exposure modes | soft, hard and vacuum contact |
| Alignment | top-side or infrared, Singlefield or Splitfield microscope |
| Illumination | MO Exposure Optics with micro-lens plates |
Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +880 1711-738207 | Email: info@vvon.com.bd
An automated mask aligner for 200 mm and 300 mm wafers in advanced packaging. It patterns through silicon vias, redistribution layers and bumping levels by proximity lithography, and copes with thick resist films that fall outside stepper capability.
A semi-automated mask aligner and imprint platform for contact and proximity lithography. It exposes photoresist through a physical mask and also runs UV nanoimprint, serving MEMS and NEMS, advanced packaging, micro-optics and compound semiconductor work in research and pilot production.
A fully automated mask aligner for high volume production of wafers and square substrates up to 200 mm. It pairs DirectAlign alignment with MO Exposure Optics illumination and ThermAlign thermal compensation for MEMS, radio frequency and power device manufacturing.