Brand: SUSS MicroTec | Category: Nanotechnology
A temporary bonder for 200 mm and 300 mm wafers built for volume manufacturing. Its modular frame accepts commercially available temporary bonding adhesives on silicon or glass carriers, and an on-board metrology module checks alignment during the run.
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm and 300 mm |
| Alignment accuracy | below 100 nm overlay with XBA Inter Substrate Alignment |
| Carriers | silicon and glass |
| Adhesives | all commercially available temporary bonding adhesives |
| Metrology | integrated module for real-time measurement |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for SUSS MicroTec.
Phone: +880 1711-738207 | Email: info@vvon.com.bd