Brand: SUSS MicroTec | Category: Nanotechnology
An automated mask aligner for 200 mm and 300 mm wafers in advanced packaging. It patterns through silicon vias, redistribution layers and bumping levels by proximity lithography, and copes with thick resist films that fall outside stepper capability.
| Parameter | Value |
|---|---|
| Wafer sizes | 200 mm and 300 mm |
| Alignment accuracy | 0.5 µm top-side with DirectAlign |
| Alignment options | top-side, bottom-side and infrared |
| Exposure | proximity lithography with MO Exposure Optics |
| Alignment software | DirectAlign with PatMax structure detection |
Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +880 1711-738207 | Email: info@vvon.com.bd
A fully automated mask aligner for high volume production of wafers and square substrates up to 200 mm. It pairs DirectAlign alignment with MO Exposure Optics illumination and ThermAlign thermal compensation for MEMS, radio frequency and power device manufacturing.
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