Brand: SUSS MicroTec | Category: Nanotechnology
A surface preparation cluster for hybrid bonding that cleans and activates wafers without an integrated bonder, so it can feed stand-alone bonding tools. It combines aqueous cleaning, vacuum plasma activation and in-line infrared void metrology.
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm and 300 mm |
| Load ports | up to two automatic FOUP ports with cassette adapter options |
| Cassette stations | two tape frame stations |
| Handling | six axis robot |
| Void detection | resolution above 500 µm |
| Modules | aqueous cleaner, plasma activation chamber, in-situ infrared metrology |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for SUSS MicroTec.
Phone: +880 1711-738207 | Email: info@vvon.com.bd