Brand: SUSS MicroTec | Category: Nanotechnology
A hybrid bonding cluster that covers wafer to wafer, collective die to wafer and sequential die to wafer processes on one platform. Built with SET Corporation SA, it targets research and pilot lines that later scale into volume production.
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm to 300 mm |
| Wafer to wafer alignment | below 100 nm |
| Die to wafer alignment | ±100 nm |
| Die to wafer bond force | up to 300 N |
| Die spacing | down to 40 µm |
| Carriers | silicon and glass tape frame carriers |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for SUSS MicroTec.
Phone: +880 1711-738207 | Email: info@vvon.com.bd