Brand: Denton Vacuum | Category: Nanotechnology
A magnetron sputtering system for high volume production that handles substrates up to 300 mm. It takes either a single cathode for tight uniformity or up to four confocal cathodes with triaxis adjustment for co-sputtering without breaking vacuum.
| Parameter | Value |
|---|---|
| Substrate size | up to 300 mm |
| Cathodes | single cathode or up to 4 confocal cathodes with triaxis adjustment |
| Power delivery | DC, pulsed DC and RF sputtering |
| Specification | PEM technology for high rate reactive sputtering of metal oxides and nitrides |
| Front ends | single wafer load lock, cassette load lock up to 25 wafers, or cluster tool |
| Software | ProcessPro-HV with SEMI compliant user interface and data logging |
Contact Vvon Technologies Limited, Bangladesh's authorised distributor for Denton Vacuum.
Phone: +880 1711-738207 | Email: info@vvon.com.bd