Brand: Oxford Instruments | Category: Nanotechnology
The Oxford Instruments PlasmaPro 100 Reactive Ion Etcher (RIE) delivers isotropic and anisotropic dry etching for an extensive range of semiconductor, dielectric and metal processes. A rich plasma is generated above the wafer using a wafer-level RF source; ions are accelerated toward the surface to produce a highly directional anisotropic etch. The PlasmaPro 100 platform accommodates wafers up to 200 mm and supports single-wafer and batch processing with load-lock and cassette-to-cassette options for high throughput. A wide-temperature-range electrode (−150°C to +400°C) enables cryogenic etch processes. The system is clusterable with up to four process modules — including ALD, ICP, PECVD, CVD, Ion Beam Etch and Ion Beam Deposition — for complex multi-step nanofabrication workflows. Vvon Technologies is the authorised distributor for Oxford Instruments in Bangladesh.
| Parameter | Value |
|---|---|
| Platform | PlasmaPro 100 |
| Wafer size | Up to 200 mm (with carrier options for smaller substrates) |
| Electrode temperature range | −150°C to +400°C |
| Operating pressure | 5–500 mTorr |
| Total gas flow | 5–200 sccm |
| DC bias | 30–800 V |
| Power density | 0.1–1.5 W/cm² |
| Loading | Load-locked or cassette-to-cassette |
| Cluster capability | Up to 4 process modules (ALD, ICP, PECVD, CVD, IBE, IBD) |
| Wafer clamping | He backside cooling for optimum temperature control |
Contact Vvon Technologies Limited — Bangladesh's authorised distributor for Oxford Instruments.
Phone: +880 1711-738207 | Email: info@vvon.com.bd